TSMC Plans New CoWoS Plants in US and Japan Amid AI Chip Demand
- TSMC is reportedly considering building new CoWoS advanced packaging plants in the United States and Japan due to persistently strong demand for AI chips, particularly from NVIDIA. The company plans to double its production capacity in 2024 and again in 2025.
- Demand for TSMC's advanced packaging remains high, with rumors suggesting that the company aims to set up CoWoS plants to meet local needs. The supply chain for CoWoS advanced packaging has been under pressure, and TSMC is expected to expand its capacity significantly.
- TSMC's first P1 factory in Nanke Chiayi Park began construction in May 2024, although it faced a temporary suspension. The second CoWoS factory project is also underway, with expectations that it will not affect the installation schedule in Q3 2025.
- The semiconductor industry has seen the highest demand for CoWoS advanced packaging since 2013, and TSMC is currently operating at full capacity. The company is under pressure to establish more plants to keep up with the demand for AI chips.
- NVIDIA's upcoming Rubin R100 AI GPU will utilize TSMC's new CoWoS-L advanced packaging, set to launch in 2025. NVIDIA CEO Jensen Huang has urged SK hynix to expedite the release of their next-gen HBM4 memory by six months.
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